TTTC's Electronic Broadcasting Service
TTTC's Electronic Broadcasting Service

IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
(DFT 2017)
October 23–25, 2017
Cambridge, UK

http://www.dfts.org/

CALL FOR PAPERS

Scope

DFT is an annual Symposium providing an open forum for presentations in the field of defect and fault tolerance in VLSI and nanotechnology systems inclusive of emerging technologies. One of the unique features of this symposium is to combine new academic research with state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, and availability that are affected by defects during manufacturing and by faults during system operation are of interest.

The topics include (but are not limited to) the following ones:

1. Yield Analysis and Modeling: Defect/fault analysis and models; statistical yield modeling; diagnosis; critical area and other metrics.

2. Testing Techniques: Built-in self-test; delay fault modeling and diagnosis;  testing for analog and mixed circuits; online testing; signal and clock integrity.

3. Design For Testability in IC Design: FPGA, SoC, NoC, ASIC, low power design and microprocessors.

4. Error Detection, Correction, and Recovery: Self-testing and self-checking solutions; error-control coding; fault masking and avoidance; recovery schemes, space/time redundancy; hw/sw techniques; architectural-specific techniques, system-level design-time or runtime strategies.

5. Dependability Analysis and Validation: Fault injection techniques and frameworks; dependability and   characterization.

6. Repair, Restructuring and Reconfiguration: Repairable logic; reconfigurable circuit design; DFT for on-line operation; self-healing; reliable FPGA-based systems.

7. Design for Defect and Fault Tolerance: Reliable circuit/system synthesis; radiation hardened and/or tolerant processes and design; design space exploration for dependable systems, transient/soft faults and errors.

8. Aging and Lifetime Reliability: Aging characterization and modeling; design and run-time reliability, thermal, and variability management and recovery.

9. Dependable Applications and Case Studies: Methodologies and case study applications to Internet of Things,   automotive, railway, avionics and space, autonomous systems, industrial control, etc.

10. Emerging Technologies: Techniques for 2.5D/3D ICs, quantum computing architectures, microfluid biochips, etc.

11. Design for Security: Fault attacks, fault tolerance-based countermeasures, hw security assurance, hw trojans, resistance to persistent DoS, security vs. reliability trade-offs, interaction between VLSI test, trust, and reliability.

Submissions

Prospective authors are invited to submit original and unpublished contributions. Two types of submissions are possible: (i) regular papers (6 pages), and (ii) short papers (4 pages). Both types will be included in the symposium proceedings and should adhere to the IEEE conference template, 2-columns style (available on conference web site), and submitted as PDF file, electronically. Detailed information about the submission process are available on the symposium website.

Proposals for special sessions are also invited this year. For more information, visit symposium website.

Key Dates

Paper submission deadline: Apr 28, 2017

Notification of acceptance: July 1, 2017

Camera ready and author's registration: July 21, 2017

Additional Information

Awards

All papers will be considered for the DFT 2017 Best Paper Award. A best Student Paper Award (funded by Cadence) will be assigned to the best paper having a student as first author

Organization

General co-chairs:

 Program co-chairs:

 Industrial liaison chair:

 Publicity chairs:

 Publication chair:

Committee

Program Committee

  • Lorena Anghel, TIMA, FR
  • Giovanni Beltrame, École Polytechnique de Montréal, CA
  • Cristiana Bolchini, Politecnico di Milano, IT
  • Glenn Chapman, Simon Fraser University, US
  • Roy Cideciyan, IBM, CH
  • Jennifer Dworak, Southern Methodist University, US
  • Masoumeh Ebrahimi, KTH Royal Institute of Technology, SE
  • Stephan Eggersgluess, University of Bremen, DE
  • Oguz Ergin, TOBB University, TR
  • Adrian Evans, IROC Technologies, FR
  • Dimitris Gizopoulos, University of Athens, GR
  • Jie Han, University of Alberta, CA
  • Chih-Tsun Huang, National Tsing Hua University, TW
  • Hideyuki Ichihara, Hiroshima City University, JP
  • Viacheslav Izosimov, KTH Royal Institute of Technology, SE
  • Prashant Joshi, Cadence, US
  • Arun Kanuparthi, Intel Corporation, US
  • Naghmeh Karimi, University of Maryland, US
  • Ramesh Karri, NYU Polytechnic, US
  • Yong-Bin Kim, Northeastern University, US
  • Rakesh Kinger, Qualcomm Inc., US
  • Israel Koren, University of Massachusetts-Amherst, US
  • Bram Kruseman, NXP, NL
  • Sandip Kundu, University of Massachusetts-Amherst, US
  • Huawei Li, Chinese Academy of Science, CN
  • Fabrizio Lombardi, Northeastern University, US
  • Jimson Mathew, IIT Patna, IN
  • Sankaran Menon, Intel Corporation, US
  • Cecilia Metra, University of Bologna, IT
  • Maria Michael, University of Cyprus, CY
  • Mehran Mozaffari Kermani, Rochester Institute of Technology, US
  • Kazuteru Namba, Chiba University, JP
  • Nicola Nicolici, McMaster University, CA
  • Chrysostomos Nicopoulos, University of Cyprus, CY
  • Marco Ottavi, University of Rome “Tor Vergata”, IT
  • Ilia Polian, University of Passau, DE
  • Irith Pomeranz, Purdue University, US
  • Salvatore Pontarelli, University of Rome “Tor Vergata”, IT
  • Mihalis Psarakis, University of Piraeus, GR
  • Amir Rahmani, University of California Irvine, US
  • Paolo Rech, UFRGS, BR
  • Sudhakar Reddy, University of Iowa, US
  • Pedro Reviriego, Universidad Nebrija, ES
  • Daniele Rossi, University of Westminster, UK
  • Fabio Salice, Politecnico di Milano, IT
  • Chiara Sandionigi, CEA, FR
  • Mario Schölzel, Universität Potsdam / IHP, DE
  • Muhammad Shafique, Technische Universität Wien, AT
  • Ioannis Sourdis, Chalmers University of Technology, SE
  • Vilas Sridharan, AMD, US
  • Mottaqiallah Taouil, TU Delft, NL
  • Mohammad Tehranipoor, University of Connecticut, US
  • João Paulo Teixeira, IST/INESC-ID, PT
  • Nur Touba, University of Texas at Austin, US
  • Spyros Tragoudas, Southern Illinois University Carbondale, US
  • Qiang Xu, Chinese University of Hong Kong, HK
  • Sheng Yang, ARM, UK
  • Tomohiro Yoneda, National Institute of Informatics, JP
For more information, visit us on the web at: http://www.dfts.org/

The CONFERENCE is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail 
chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo Sonza Reorda
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
Tel. +34-93-401-6603
E-mail figueras@eel.upc.es

ITC GENERAL CHAIR
Michael Purtell
Intersil
- USA
Tel. +1-408-372-6015
E-mail m.purtell@ieee.org

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
Tel. +39-011-564-7183
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
Tel. +33-467-41-85-01
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
Tel. +33-467-41-85-01
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 2ND VICE CHAIR
Rohit KAPUR

Synopsys, Inc.
- USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Intel - USA
E-mail 
chen-huan.chiang@intel.com

IEEE DESIGN & TEST EIC
André IVANOV
U. of British Columbia - Canada
Tel. +1
E-mail ivanov@ece.ubc.ca

TECHNICAL MEETINGS
Chen-Huan CHIANG
Intel - USA
E-mail 
chen-huan.chiang@intel.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39 090 7055
E-mail matteo.sonzareorda#polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
Tel.+81-743-72-5221
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com


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